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MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes: RoHS
Features
* * * * * * * *
Surface Mount No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling RoHS Compliant
M/A-COM Products
Rev. V5
Description This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. Applications These packageless devices are suitable for moderate incident power applications, 10W/C.W. or where the peak power is 50W, pulse width is 1S, and duty cycle is 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts.
G
D
E
F
DIM
A B C D E F G
INCHES MIN
0.040 0.021 0.004 0.013 0.011 0.013 0.019
MM MIN
1.025 0.525 0.102 0.325 0.275 0.325 0.475
MAX
0.042 0.023 0.008 0.015 0.013 0.015 0.021
MAX
1.075 0.575 0.203 0.375 0.325 0.375 0.525
Absolute Maximum Ratings1@ TAMB = +25C
(unless otherwise specified) Parameter MADP-042...-13060
C.W. Incident Power dBm Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Mounting Temperature
Absolute Maximum 305
40
405
44
505
43
905
35
Notes:
1. Backside metal: 0.1 M thick. 2. Yellow hatched areas indicate backside ohmic gold contacts. 3. All devices have the same outline dimensions ( A to G).
250 mA -80 V -55C to +125C -55C to +150C +175C +280C for 10 seconds
1. Exceeding these limits may cause permanent damage.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for * North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed.
information contained herein without notice.
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes: RoHS
Electrical Specifications @ TAMB = + 25 C
Parameter
Capacitance Capacitance Capacitance Capacitance Resistance Resistance Forward Voltage Reverse Leakage Current Input Third Order Intercept Point C.W. Thermal Resistance Lifetime
M/A-COM Products
Rev. V5
Symbol
CT1,3 CT1,3 CT1,3 CT1,3 RS2,3 RS2,3 VF IR
Conditions
- 10V, 1 MHz 1 - 10 V, 1 GHz 1,3 - 40 V, 1 MHz 1 - 40 V, 1 GHz 1,3 + 20 mA, 1 GHz 2,3 + 50 mA, 1 GHz 2,3 + 10 mA -80V F 1= 1000 MHz F2 = 1010 MHz Input Power = +20 dBm I bias = + 20 mA
Units
pF pF pF pF W W V uA
Min Typ Max MADP-042305-13060
0.14 0.15 0.13 0.14 1.32 1.18 0.87 0.22 0.22
Min Typ Max MADP-042505-13060
0.28 0.28 0.27 0.27 0.83 0.76 0.84 0.40 0.40
1.00 10
1.00 10
IIP3
dBm
72
76
TL +10 mA / -6 mA ( 50% - 90% V )
C/W nS
145 180
115 210
Parameter
Capacitance Capacitance Capacitance Capacitance Resistance Resistance Forward Voltage Reverse Leakage Current Input Third Order Intercept Point C.W. Thermal Resistance Lifetime
Symbol
CT
1,3
Conditions
- 10 V, 1 MHz 1 - 10 V, 1 GHz 1,3 - 40 V, 1 MHz 1 - 40 V, 1 GHz 1,3 + 20 mA, 1 GHz 2,3 + 50 mA, 1 GHz 2,3 + 10 mA -80V F 1= 1000 MHz F2 = 1010 MHz Input Power = +20 dBm I bias = + 20 mA
Units
pF pF pF pF W W V uA
Min
Typ
0.61 0.61 0.57 0.58 0.62 0.58 0.82
Max
0.75 0.75
Min
Typ
0.06 0.06 0.06 0.06 3.14 2.60
Max
0.18 0.18
MADP-042405-13060
CT1,3 CT1,3 CT1,3 RS2,3 RS2,3 VF IR
MADP-042905-13060
1.00 10
0.93
1.00 10
IIP3
dBm
80
65
4 +10 mA / -6 mA ( 50% - 90% V )
C/W
100
185
TL
nS
255
140
1. 2. 3. 4.
Total capacitance, CT, is equivalent to the sum of junction capacitance ,CJ , and parasitic capacitance, Cpar. Series resistance RS is equivalent to the total diode resistance : RS = RJ ( Junction Resistance) + RC ( Ohmic Resistance) RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package. Theta () is measured with the die mounted in an ODS-1134 package.
Specifications Subject to Change Without Notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for * North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed.
information contained herein without notice.
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes: RoHS
Typical Performance @ TAMB = +25 C
Ct @ 1GHz 0.800 0.700 0.600 0.500 Ct (pF) 0.400 0.300 0.200 0.100 0.000 0 5 10 15 20 Bias (V) 25 30 35 40 042505 042305 042905 042405
M/A-COM Products
Rev. V5
Ct vs. V
10.000
Rs @ 1GHz
Rs vs. I
042905 042305 1.000 042505 042405
Rs (ohm)
0.100 0.001
0.010 Bias (A)
0.100
Ct @ 10V 0.700 042405 0.600 0.500 Ct (pF)
Ct vs. F
0.700
Ct @ 40V
Ct vs. F
042405
0.600 0.500 Ct (pF) 0.400 0.300 0.200 0.100 042505
0.400 0.300 0.200 0.100 042905 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz) 042505
042305
042305
042905 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz)
Rs @ 10mA 4.50E+00 4.00E+00 3.50E+00 3.00E+00 Rs (ohm) 2.50E+00 2.00E+00 1.50E+00
Rs vs. F
4.00E+00 042905 3.50E+00 3.00E+00 Rs (ohm) 2.50E+00 2.00E+00 1.50E+00 1.00E+00 5.00E-01 0.00E+00
Rs @ 20mA
Rs vs. F
042905
042305 042505
042305 042505
1.00E+00 5.00E-01 0.00E+00 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz) 042405
042405
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz)
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for * North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed.
information contained herein without notice.
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes: RoHS
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
M/A-COM Products
Rev. V5
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150C. When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of 60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die, apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , "Surface Mounting Instructions" and can viewed on the MA-COM website @ www.macom.com
Ordering Information
The MADP-042XX5-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/A-COM website @ www.macom.com.
Part Number Gel Pack MADP-042305-13060G MADP-042405-13060G MADP-042505-13060G MADP-042905-13060G Tape and Reel Surf Tape MADP-042305-13060T MADP-042405-13060T MADP-042505-13060T MADP-042905-13060T Tape and Reel Pocket Tape MADP-042305-13060P MADP-042405-13060P MADP-042505-13060P MADP-042905-13060P
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for * North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed.
information contained herein without notice.

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